微电子专业英语翻译The 3D integrated circuit (3D IC) is an emerging te
微电子专业英语翻译
The 3D integrated circuit (3D IC) is an emerging technology that vertically stacks
multiple die with a die-to-die interconnect as illustrated in Fig. 10.1. The die-to-die
via pitch is very small and provides the possibility of arranging digital functional
unit blocks across multiple die at a very fine level of granularity. This results in
a decrease in the overall wire length, which translates into less wire delay and less
power. Thus, 3D ICs can address the wire delay problem effectively by replacing the
long and slow global interconnects with short and fast vertical routes. Advances in
3D integration and packaging are undoubtedly gaining momentum and have become
of critical interest to the semiconductor community. These 3D integrated circuit and
package manufacturing technologies are rapidly being adopted by several leading
companies for commercial applications.
The location of individual micro-architectural modules plays a significant role on
many important metrics. First, floorplanning has a huge impact on the performance
of a given micro-architecture [measured by instructions per cycle (IPC)] as the
global interconnects between modules are likely to be pipelined in order to meet
high target clock frequencies. This may increase or decrease the access latency
on all inter-module interconnects. Second, the thermal and leakage profile is
highly correlated to the floorplan. This is because the temperature of each microarchitectural
module is not solely dependent on the heat generation rate of each
individual module but also the heat coupling between its neighboring modules.
Moreover, the leakage power of each transistor is exponentially proportional to the
temperature. Third, floorplanning affects the dynamic power consumption of the
buses and clock distribution network. The total number of flip-flops (FFs) inserted
on global interconnects changes the dynamic power consumed by the clock distribution
network. However, the performance and thermal objectives are conflicting with
each other since shorter distance among the hot modules improves the performance
while exacerbating the thermal issue. To address the different design constraints of
different domains, we need a goal-directed, automated floorplanner that allows users
to weight their own design requirements and make effective design tradeoffs. The
following specific topics are covered in this chapter